Sample Semiconductor Master Data Guide#

Overview#

A sample Master Data specifically designed to cover Semiconductor Industry use-cases is available for download for each Semiconductor template release in the Information Center ⧉.

This modelling guide intends to guide the user on:

1. How to Setup and upload the Master Data into a CM MES environment.
2. Explain the user the business context included in the Master Data.
3. Which MES features are included in the Master Data, and which processes - both Front-End and Back-End - are covered by these features.

By providing a sample Master Data set that users can upload directly into the MES and start using immediately, we intend to:

• Illustrate how the MES standard functionalities work: Show users concrete examples of Products, Flows, Resources, BOMs and other entities so they can understand how the out‑of‑the‑box MES features are meant to be used, particularly in Semiconductor business scenarios.
• Showcase best‑practice usage patterns for Semiconductor Industry use-cases: Showcase recommended patterns for Flows, Products, Resources, Material Tracking, and overall model, that align with MES best practices for common Semiconductor business scenarios.
• Provide a ready‑to‑use baseline: Give customers a starting point they can upload “as‑is” or adapt, so they don’t have to build all master data from scratch before using core MES capabilities.
• Accelerate training and configuration: Help users get up and running faster by showing what a minimal, working master data set looks like, shortening the learning curve for new instances.
• Provide a quick Setup data for MES Demos: Provide a sample master data that can be used to quickly configure and run MES demonstrations in a semiconductor business context.

Master Data Setup#

Master Data is organized in several model blocks, with only the Base Model being mandatory. Based on the needs and objectives, additional blocks can be uploaded on top of the Base one.
By uploading the other blocks the user will be able to explore other features of the MES, included in additional MES modules: - Engineering Model: Recipe Management, Labor Management, Documents Management. - Quality Model: Sampling, SPC, Exceptions Management, Mapping. - Maintenance Model: Maintenance Management. - Planning Model: Advanced Planning & Scheduling. - FabLIVE: FabLIVE.

Base Model#

By using the provided Base Model, users will be able to perform the core operations of the MES such as run a Material through a Production Flow. The main Production Flows - both in Front-End Facility in Back-End Facility - are enriched in order to simulate activities commonly found in a real semiconductor fab, giving users the opportunity to explore MES capabilities in a realistic environment. By moving a Lot through the Flow, users can experience functionalities such as automatic consumption based on BOM, Rework Flows, Time Constraints, Production Orders, Notifications and other core features.

1. Using the MES MasterData Package, from the folder 1_base:

   • Select the File masterdata_semi_base1.zip ⧉: Select and load all the items.
   • Select the File masterdata_semi_base2.xlsx ⧉: Select and Load all the items.
   • Select the File masterdata_semi_base3.xlsx ⧉: Select and Load all the items.
     

2. For Material attributes, open Entity Type “Material” >> Generate.

3. Future actions “Send e-mail” were set for the Steps “RwPGMA”, “AOI” and “Shipping Final Customer”. Please change the e-mail defined in the Distribution List.

4. Four Business Workflows were uploaded with the 1st MasterData. If you wish to use them, please set them effective.

5. NameGenerator for manual Split and Expand: to use them, please open the DEE “ResolveNameGenerator:

   • For the case “SplitMaterialInput” and “GradeMaterialInput” change from “MaterialNameGenerator” to “SplitLotNameGenerator”.
   • For the case “ExpandMaterialInput” change from “MaterialNameGenerator” to “ExpandNameGenerator”.

6. To use Material Logistics Module, Store all the Raw Materials available in the Steps “Store FE Warehouse” and “Store BE Warehouse” in the “Racks”. Meanwhile, all the other consumables that will reach these Steps will be stored automatically through a Business Workflow.

7. For the same purpose and to test automatic Replenishment within the Storage Resource, open these Storage resources and store all the components (Except Durables and Sputtering Targets).

   • KANBAN-FE1 / KANBAN-FE2 / KANBAN-FE3 / KANBAN-BE1 / KANBAN-BE2 (Except “Epoxy Resin B2B” ) / KANBAN-BE3 / KANBAN-BE5 (Only Module INVECO 5G + Rod + I-bracket)

8. If you are not using a User from the Master Data, and if not set yet, define a PIN and Employee for your user.

Engineering Model#

By adding the Engineering model on top of the Base Model, users will be able to perform Checklists and Data Collections, check relevant Documents to a given operation (such as Equipment manuals), review the Recipe to be used in a specific Resource and override Recipe Parameters, ensure that Employees have the required Certifications to operate a Resource or to perform a given operation, and carry out Setup and Line Clearance when needed, among other functionalities. Engineering Model block also includes an example of an Experiment Definition and a set of pre-configured actions that will take place in each Step - users should assign the Experiment Definition to Materials Lot-2EDN7524F-EXPA01 or Lot-2EDN7524F-EXPB001.

1. If needed, Update the Dates from “EmployeeQualification” and “EmployeeCertification” Tabs.

2. Using the MasterData Package, from the folder 2_engineering:

   • Select the File masterdata_semi_eng1.zip ⧉: Select and load all the items.
   • Approve ChangeSet “CS-Label1”.
   • Select the File masterdata_semi_eng2.xlsx ⧉ : Select and Load all the items.

3. Create a new Version of the Experiment “Experiment SEMI1” and set your e-mail in the Action “SendMail”

4. The User you are using may need: Employee, Qualification and Certification to process Material in some Steps and Resources.

Quality Model#

The Quality Model Master Data allows users to explore MES functionalities that support the conformity of wafers and components produced. It includes capabilities such as the creation and management of Protocols, Sampling Plans, Inspection Plans, and Statistical Process Control (SPC), helping ensure that products meet the required quality standards throughout the manufacturing process.

1. Using the MasterData Package, from the folder 3_quality:

   • Select the File masterdata_semi_qual1.zip ⧉ : Select and load all the items.
   • Select the File masterdata_semi_qual2.xlsx ⧉ : Select and load all the items.

2. To use Smart Table “ChangeSetContextApprovalContext” Table, open the desired versionable entity:

   • Flag option “Allow Automatic Change Set”
   • Flag option “Use Change Set Approval Context”
   • Click on Generate.

3. For Material Defect, create a new version of the Product “RGB Drivers INVECO” and click Import (note that "Apply Component Mapping" flag should be enabled):

Maintenance Model#

Maintenance Model allows the user to create Maintenance Plans for the Resources, Areas, Containers or Parts, such as annual maintenances, shift change checks, calibrations and Equipment Qualifications. Each Maintenance Plan include a set of Maintenance Activities, which contains all required configurations required for the activity: Checklists, Data Collections, BOMs, Documents, and Required Ceritifications.

1. Using the MasterData Package, from the folder 4_maintenance

   • Select the File masterdata_semi_maint1.zip ⧉ : select and load all the items.

2. To assign the Maintenance Plans to some equipment:

   • Select the File masterdata_semi_maint2.xlsx ⧉ : Select and load all the items.

3. To use Material Logistics module, Store all the Parts available in the Steps “Store BE Parts Warehouse” in the “Racks”.

Planning Model#

The Planning block of the Master Data provides users with a set of realistic production Plans, Schedules and Shift Plans, enabling them to explore the out-of-the-box Planning functionalities available in CM MES through semiconductor-focused scenarios and to create new scenarios based on representative situations.

1. Update the Dates of the Plan Scenarios, if required.

2. Using the MasterData Package, from the folder 5_planning:

   • Select the File masterdata_semi_plan1.xlsx ⧉ - Select and load all the items.

FabLive#

FabLive provides a visual representation of the Front-End Production Facility of this model. Through this example, users can explore the FabLive module and understand how its functionalities can be used to navigate, monitor, and interact with the Production shopfloor.

1. From the Folder 6_fablive, import the FabLive file fablive_semi_frontend.xml ⧉ into your MES environment (Admnistration>FabLive>Import).

Semi Template#

1. Make sure the Semiconductor Template package is installed in the environment. To quickly verify this, go to Administration > Configuration and check if Semi configs section is available:

1. Using the MasterData Package, open the Folder SEMI TEMPLATE:
   • Select the File MasterData 11.3 SEMI TEMPLATE.zip ⧉.

Business Case Context#

• The sample master data portrays a fictional company, KommSemi, a worldwide Semiconductor manufacturer opened two new sites in Europe. A Front-End that supply the wafers to its own Back-End. For its part, the Back-End ships most of the production to the final customers, whilst retaining some products to assemble modules internally to be sold to a specific client.
  

Based on the above, the following sections intend to provide users with additional context on the Semiconductor processes covered by the Master Data, as well as the MES functionalities they will be able to explore within each Step and Flow.

Front-End#

• Six Finished Good Products run in the Front-End site. This site has a production Facility and a warehouse where the consumables are controlled and managed; and sent to the Production when they run low or whenever requested by the production team.
  
• Quality level characteristic and some Material properties determine if some inspections are skipped or realized. The photoresist to be used in some lithography layers is also determined by a characteristic when the Production Order is created in the MES.
  
• At the end of the process the wafers are transferred from FOUP to FOSB and then packed into Shielding Foil before they can be shipped to the Back-End site.

Front-End Process:

Front-End Site Overview:

Front-End Functionalities:

In order to easily understand the structure of the Master Data provided, tables below are showing which functionalities the user can find in each Step and Flow.

Main Flow: Y31_CSP_3L

Rework Flows:

1. Rework Flow: RWK_FUSE Photoresist
   Linked to Steps (Logical Names from FUSE Step):
2. COAT
3. EXPOSE
4. DEVELOPER
5. INSP CD

1. Rework Flow: RWK_FUSE Photoresist TC
   Linked to Steps (Logical Names from FUSE Step):
   • COAT
   • EXPOSE
   • DEVELOPER
   • INSP CD
   • INSP Overlay
   • CureWafers

1. Rework Flow: RWK_POLYMIDE Photoresist
   Linked to Steps (Logical Names from POLYMIDE Step):
   • COAT
   • EXPOSE
   • DEVELOPER
   • INSP CD

1. Rework Flow: RWK_POLYMIDE Photoresist TC
   Linked to Steps (Logical Names from POLYMIDE Step):
   • COAT
   • EXPOSE
   • DEVELOPER
   • INSP CD
   • INSP Overlay
   • CureWafers

1. Rework Flow: RWK_AOI FUSE
   Linked to Steps (Logical Names from FUSE Step):
   • AOI

1. Rework Flow: RWK_AOI POLYMIDE
   Linked to Steps (Logical Names from POLYMIDE Step):
   • AOI

1. Rework Flow: RWK_PRECURE
   Linked to Steps
   • PRECURE
   • ASHING PRE
   • COAT (Logical Name from FUSE Step)

Material Logistics Model:

Flow: Store FE Warehouse

From the Store FE Warehouse Step, Materials are moved via Transfer Requirements to specific Steps in the Front-End production Area to be consumed, based on Material Logistics configurations:

Back-End:#

• After receiving the wafers from the Front-End, they are diced and then bounded on substrates in the Back-end. The Back-End site has an independent warehouse to control and managed the consumables. These can then be sent to the Production Facility when requested automatically and when they are under the reorder point.
• Some Material properties/characteristics determine if some inspections are skipped or realized and the quantity of Mold compound to be consumed during the encapsulation process. After the Assemble process, the dies are tested in the burn-in and Test Area.
• Most of the Products are packed in Tape & Reel before they are sent to the final customer, and a few are sent to a storage to be consumed in modules that the company sell to a specific client.

Back-End Process:

Back-End Site Overview:

Back-End Functionalities:

Flow: SAWING

Flow: PRINTING

Flow: Flow Resin preparation

Flow: Flow Resin preparation

Flow: #BGA

Flow: Flow Module INVECO 5G

Rework Flows:

1. Rework Flow: RWK_Wire Plasma
   Linked to Steps:
   • Wire Plasma
   • Wire Bond

1. Rework Flow: RWK_SBA
   Linked to Steps:
   • Ball Attach
   • 3D Inspection
   • Ball Shear

1. Rework Flow: RWK_PSBIAS_CTEST
   Linked to Steps:
   • Burn-IN
   • BI Disposition

Material Logistics Model:

Flow: Store BE Warehouse

From the Store BE Warehouse Step, Materials are moved via Transfer Requirements to specific Steps in the Back-End production Area to be consumed, based on Material Logistics configurations: