Handle Abort Mid Process#

Estimated time to read: 7 minutes

The Handle Abort Mid Process feature supports the configuration of wafer classification and defines the actions to be applied for each classification.

It ensures the correct action is taken for each wafer or set of wafers when the process is unexpectedly interrupted.

Overview#

This tutorial covers the following sections:

• Feature overview - Explains how Handle Abort Mid Process is intended to be used.
• Scenario - A simplified example to help understand the underlying logic.
• Configuration - A step-by-step guide with screenshots and links to key documentation.
• Execution - Using the feature to run the setup and see it in action, including a video walkthrough.

Feature#

This feature enables the creation of a Processing Issue, allowing users to classify the processing state of each sub-material (for example, processed, not processed, issue).

Based on the defined classification, the system automatically executes the appropriate disposition actions, which typically include:

• Split and Track Out the processed sub-materials.
• Split the mid-process sub-materials (according to each issue type), abort them, send to rework, and place them on hold.
• Abort the remaining non-processed sub-materials from the original lot.

After classifying each sub-material, a Protocol can be opened with a workflow for issue investigation when a sub-material is classified as having an issue or being in an unknown state. Following the investigation, the sub-material's processing state and classification can be updated.

The corresponding disposition actions are then automatically triggered once the Protocol is closed.

A Future Merge can be automatically set to join all the materials back together once the pending sub-materials are reprocessed.

Scenario#

Configuration#

To assess how this industry and production requirement is addressed, consider a simplified model:

Basic entities like Step, Resource, Flow, Product, and Material can be configured as detailed below:

• Step - Coating
• Resource - COATER-001
• Flow - Flow_Metallurgy
• Product - Engine Block H08-P9
• Material - Engine Block H08-P9.002 (this Material has three sub-materials)

Lookup Tables#

There are several Lookup Tables that need to be configured for this scenario:

1. SemiProcessingClassification

   

2. SemiProcessingIssueAction

   

   Info

   This table should not be updated with more actions, as this would require subsequent changes to the actual application code.

3. SemiProcessingIssueActionPlan

   

4. SemiProcessingIssueMergeOption

   

   Info

   This table should not be updated with more actions, as this would require subsequent changes to the actual application code.

Generic Tables#

There are several Generic Tables that need to be configured for this scenario:

1. SemiProcessingClassificationSettings

   Define the default action to be executed per Processing Issue and whether a Protocol can be triggered. If the Can Trigger Protocol option is enabled, the Material opens a Protocol after classifying wafers. The actions are executed only after closing the Protocol.

   

2. SemiProcessingIssueActionPlans

   Define the default actions to be executed for a set of wafers based on the Processing Issue and specify whether a merge occurs.

   

   Note

   This is the Master Data file used for this scenario.

Smart Tables, Protocols, and Data Collection#

For all remaining configurations, follow these steps:

1. Create these two Parameters:

   

   

   Useful Documentation

   • Create Parameter
   • How to: Create a Parameter

2. Create a Data Collection:

   

   

   The second Data Collection will be used later in the second scenario of this tutorial.

3. Assign both Parameters to the Data Collection created above:

   

   Useful Documentation

   • Create Data Collection
   • How to: Create a Data Collection
   • MaterialDataCollectionContext
   • How to: Add Value to Smart Table

   Note

   There is a specific Entity Type - SemiDataCollectionInstanceProtocolInstanceRelation - to support the Handle Abort Mid Process functionality.

4. Fill in these two configuration entries with the names of the Parameters created above.

   These configuration entries are filled by default in the system.

   

   Useful Documentation

   • Configuration

5. Create a Checklist:

   

   For this scenario, use the following settings in the General Data:

   • Activity Type - Automatic Action
   • Rule - insert the out-of-the-box Rule called SemiProtocolDispositionExecutionRule

   For the Handle Abort Mid Process, this Rule will be automatically triggered when closing the Protocol and it will execute the actions defined in the Data Collection.

   

   This Checklist is assigned to the Protocol to execute the actions automatically.

   

   Useful Documentation

   • Create Checklist
   • How to: Create a Checklist

6. Create a Protocol:

   

7. Create the desired states of the Protocol and add the previously created Checklist in one of them:

   

   Useful Documentation

   • Create Protocol

8. Create a Hold Reason and assign it to the steps where this behavior occurs. The reason must have the SemiProcessingIssueTempHoldReason attribute set to true. This means the system searches for Hold reasons with this attribute enabled when performing an automatic release. This attribute is automatically created by the system.

   

9. Fill in the SemiProcessingIssueContext table based on the image below:

   • Assign the Data Collection previously created.
   • Assign the Protocol previously created.
   • Define the Hold Reason to be used for placing the Material on Hold while the Protocol is being executed.

   

   Note

   This is the Master Data file used for this scenario.

Execution#

This section explores the Handle Abort Mid Process operations. To test and execute this functionality, follow the use case outlined in a step-by-step scenario and demonstrated in the video at the end of the description.

First Scenario#

1. In the Step Coating, select the Material Engine Block H08-P9.002 and ensure the sub-materials are assigned to a Container.
2. Perform a Material Track In.
3. With the Material in the In Process state, select Open Issue.
4. Classify wafers according to the classification below:
   • Wafer 1 as Processed
   • Wafer 2 as Processed
   • Wafer 3 as Unknown
5. The entire Material is placed on Hold and a new Protocol is opened. The system selects the Hold Reason defined in theSemiProcessingIssueContext table.
6. Execute the Protocol.
7. After closing the Protocol, splits are performed according to the previously assigned classification:
   • Wafer 1 and 2 perform Track Out and then wait for wafer 3.
   • Wafer 3 is aborted and placed on Hold.
8. For wafer 3, perform Release, Track In, and Track Out to the Coating Step. After Track Out, this wafer is merged back into the remaining lot.

Second Scenario#

For this scenario, use the same Step and Materials. However, in the SemiProcessingIssueContext table, change the Data Collection to SemiProcessingIssueHandling and remove the Protocol.

1. In the Step Coating, select the Material Engine Block H08-P9.002 and assign the sub-materials to a Container.
2. Perform a Material Track In.
3. With the Material in the In Process state, select Open Issue.
4. Classify the Processing status based on the classification below:
   • Wafer 1 as Processed
   • Wafer 2 as Processed
   • Wafer 3 as Not Processed
5. Classify the Disposition Action based on the actions below:
   • Wafer 1 as Hold
   • Wafer 2 as Hold
   • Wafer 3 as Abort
6. Execute the Protocol.
7. After closing the Protocol, splits are performed according to the Disposition Action defined previously:
   • Wafer 1 and 2 on hold.
   • Wafer 3 is aborted.
8. This disposition is executed according to the Disposition action provided during the Data Collection execution - SemiDispositionActionPlan parameter.
   • This parameter overrides the default actions defined in the SemiProcessingClassificationSettings Generic Table.
9. For wafer 3, perform Track In and Track Out to the Coating Step.
10. For wafer 1 and 2, perform Release and Track Out.
11. After Track Out, both lots are automatically merged.